ARM has announced EuroCloud, a European Commission-funded project designed to investigate the use of its multi-core processors in data centres in order to improve energy efficiency. The chip maker explained that it will partner with Nokia, IMEC, EPFL and the University of Cyprus to analyse the value proposition of coupling low-power processing with 3D chip packaging systems.

Combined, ARM expects these could lead to improvements in cost and energy efficiency when compared to the approach used in "incumbent server platforms". Such systems are not as efficient as they could be, according to ARM, and create power, cooling and density challenges for firms looking to run or host web 2.0 applications.

Source: V3

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